On March 10, Secretary Gina Raimondo joined Indian Minister of Commerce and Industry Piyush Goyal and announced a U.S.-India Memorandum of Understanding (MOU) that will establish a Semiconductor Supply Chain and Innovation Partnership. The MOU was announced at the relaunch of the U.S.-India Commercial Dialogue and will focus on clean energy as well as semiconductor supply chains. The Secretary was in New Delhi from March 5-10 where she met with Prime Minister of India Narendra Modi, attended the U.S.-India CEO Forum, and held several important bilateral meetings with Indian officials. “As both of our great nations seek to create stronger and more secure supply chains, particularly in the field of semiconductors, this MOU will establish a collaborative mechanism between our two countries on semiconductor supply chain resiliency and diversification and will aim to create economic opportunity in the U.S. and India,” said Secretary Raimondo in a statement. “This is a significant step in the coordination of both our countries’ semiconductor incentive programs and will strengthen mutual priorities, including promoting commercial opportunities, R&D, and talent and skill development.”
To begin her trip, India’s Defense Minister Rajnath Singh hosted Secretary Raimondo at his home in honor of the annual Hindu festival Holi. Several other Indian officials also joined the festivities.
“A day filled with color, joy, and light,” said Raimondo. “May we carry it with us as we continue to strengthen the bonds between India and the United States.”
Later in the week, Secretary Raimondo met with Prime Minister of India Narendra Modi where they discussed the U.S.-India CEO Forum and U.S.-India Commercial Dialogue as well as the new Strategic Trade Dialogue and U.S.-India MOU on Semiconductor Supply Chain and Innovation Partnership.
At the U.S.-India CEO Forum, Raimondo stressed the importance that the Biden Administration places on U.S.-India relations and emphasized the significant opportunity to deepen commercial ties between the two countries.
The U.S.-India CEO Forum was soft-launched by Secretary Raimondo and Indian Commerce & Industry Minister Goyal in November 2022 during a meeting between the two leaders. During the meeting, they identified key priorities as increasing supply chain resilience; enhancing energy security & reducing overall greenhouse gas emissions; advancing inclusive digital trade; and facilitating post-pandemic economic recovery, especially for small businesses.
Throughout her visit, Secretary Raimondo also held several bilateral meetings with ministers from India including Minister of Electronics and Information Technology Ashwini Vaishnaw, Minster of External Affairs Dr. S. Jaishankar, Minister of Finance Nirmala Sitharaman, Minister of Education and Skill Development and Entrepreneurship Dharmendra Pradhan, and Indian National Security Advisor Ajit Doval. During these meetings, the Secretary discussed key areas of shared interest, including the Indo-Pacific Economic Framework for Prosperity, semiconductors, and supply chain resilience.
The trip comes on the heels of last month’s successful special negotiating round for the Indo-Pacific Economic Framework in New Delhi, which was attended by senior U.S. Department of Commerce officials.
최신 산업 동향을 받아보려면 구독하세요.저희 뉴스레터는 전문가가 제공드리는 가치있는 시장 정보입니다.
The US has initiated a Section 301 investigation into China's mature semiconductor processes and third-generation silicon carbide (SiC) semiconductors. Supply chain operators state that the increa
In 2025, we expect 9.5% growth in the global semiconductor market, driven by robust demand for data centre services, including AI. However, growth in other, more mature segments is expected to be stag
Taiwanese chip manufacturer TSMC has announced a $100 billion investment in the United States, aiming to build five additional semiconductor facilities.The plan was revealed by TSMC CEO C.C. Wei along
Prices of mature process memory, long hit by oversupply due to fast capacity expansion at Chinese makers, are expected to rebound, thanks to the Chinese government's consumption stimulus programs.
With the ongoing development of new-generation processors, the introduction of PCIe Gen5 specifications into high-end PC applications is set to commence in 2025. According to Micron Technology, Gen4 p
The global market is watching how TSMC, pressured by the US, might assist Intel's foundry operations, while Samsung Electronics and Rapidus, also facing challenges, may similarly require TSMC'