Taiwanese chip manufacturer TSMC has announced a $100 billion investment in the United States, aiming to build five additional semiconductor facilities.

The plan was revealed by TSMC CEO C.C. Wei alongside President Donald Trump at the White House, highlighting efforts to reduce US reliance on Asian-made chips.

The expansion includes three new fabrication plants, two advanced packaging facilities, and a research and development centre.

Higher costs and regulatory approvals remain key challenges for TSMC, which has already faced delays at its first Arizona plant. Taiwan’s government is set to review the investment to ensure it aligns with national interests while keeping the most advanced manufacturing processes on the island.

TSMC has not yet disclosed which chip technology will be used in the new US facilities, though a second Arizona plant is expected to begin producing 2-nanometer chips in 2028.

The investment follows US government efforts to strengthen domestic semiconductor production under the CHIPS and Science Act. Trump officials have reportedly explored a deal for TSMC to take a stake in an Intel factory unit.

With billions in subsidies and tax incentives at stake, the investment reinforces the US push to secure semiconductor Lieferkettes amid growing geopolitical tensions over Taiwan.